Orthodyne Electronics (USA) - Design and manufacture wire bonding equipment for the semiconductor, automotive, and industrial mark

		Saturday, 5 July, 2008
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Category: Science » Technology » Acoustics, Ultrasound and Vibration » Ultrasound

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Orthodyne Electronics (USA)

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	Design and manufacture wire bonding equipment for the semiconductor, automotive, and industrial markets worldwide. The wire bonders ultrasonically weld aluminum wires ranging from 1.2-25 mil/33-625 microns in diameter. Sponsored Links:
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Title:	Orthodyne Electronics
Description:	A leading manufacturer of robotic wire bonding equipment for the semiconductor and microelectronics industries.
Category:	Wire - Technology - Hybrid - Power - Model - Equipment - Generators - Electronics - Ultrasonic - Automotive - Semiconductor - Aluminum - Bond - Bonding - Orthodyne - Orthodyn - Ortodyne - Ortodyn - Orthdyne - Bonder - Bonders - Interconnent - Interconnect - Drahtbonder - Tools - Wedges - Wedge - Bonds

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