CMP Technology Inc. - Develops and markets a software package, CLIP a silicon validated yield enhancement solutions for semiconductor CMP process through full-chip simulation, density calculation and dummy filling.

		Wednesday, 15 October, 2008
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CMP Technology Inc.

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	Develops and markets a software package, CLIP a silicon validated yield enhancement solutions for semiconductor CMP process through full-chip simulation, density calculation and dummy filling. Includes product descriptions and industry news. Sponsored Links:
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Title:	CMP Technology - Simulation, pattern density calculation and dummy filling for better planarization and yield for aluminum, copper, ILD and STI CMP process using HDP or CVD film. Joint optimization with OPC, PSM and interconnect parasitic extraction.
Description:	CMP technology provides software package CLIP for pattern density calculation, CMP simulation and smart dummy fill to improve uniformity and yield for cmp process. The software works for aluminum, copper, HDP, CVD and STI.
Category:	Yield - Technology - Computation - Pattern - Density - Process - Calculator - Planarization - Uniformity - Dummy - Clip - Intercon - Dummification - Plot - Planarity - Tcad - Www.cmptechnology.com

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